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tl(rh,rmh,sh,oh,yh)1100d(t11) 2011-03-15 1 toshiba led lamps tlrh1100d(t11),tlrmh1100d(t11),tlsh1100d(t11) tloh1100d(t11),tlyh1100d(t11) panel circuit indicators ? surface-mount devices ? 3.2 (l) mm 2.8 (w) mm 1.9 (h) mm ? flat-top type ? ingaa ? p leds ? high luminous intensity ? low drive current, high-i ntensity light emission ? colors: red, orange, yellow ? applications: automotive use, message signboards, backlighting, etc. ? standard embossed tape pack ing: t11 (2000 pcs / reel) 8-mm tape reel color and material unit: mm jedec D jeita D toshiba 4-3r1 weight: 0.035 g (typ.) part number color material tlrh1100d red tlrmh1100d red tlsh1100d red tloh1100d orange tlyh1100d yellow ingaa ?p
tl(rh,rmh,sh,oh,yh)1100d(t11) 2011-03-15 2 absolute maximum ratings (ta = 25c) part number forward current i f (ma) see note 1 reverse voltage v r (v) power dissipation p d (mw) operation temperature t opr (c) storage temperature t stg (c) tlrh1100d tlrmh1100d tlsh1100d tloh1100d tlyh1100d 70 4 161 ?40 to 110 ? 40 to 110 note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: forward current derating electrical characteristics (ta = 25c) forward voltage v f reverse current i r part number min typ. max i f max v r tlrh1100d 1.6 2.0 2.3 tlrmh1100d 1.6 2.0 2.3 tlsh1100d 1.6 2.0 2.3 tloh1100d 1.6 2.0 2.3 tlyh1100d 1.6 2.1 2.3 20 10 4 unit v ma a v allowable forward current i f (ma) ambient temperature ta (c) i f ? ta 0 0 20 40 60 80 100 120 80 100 20 40 60
tl(rh,rmh,sh,oh,yh)1100d(t11) 2011-03-15 3 optical characteristics?1 (ta = 25c) luminous intensity i v part number min typ. max i f available iv rank please see note 2 tlrh1100d 63 150 320 20 qa / ra / sa tlrmh1100d 63 150 500 20 qa / ra / sa / ta tlsh1100d 160 260 800 20 sa / ta / ua tloh1100d 160 270 800 20 sa / ta / ua tlyh1100d 100 220 500 20 ra / sa / ta unit mcd mcd mcd ma ? note 2: the specification on t he above table is used for iv classification of leds in toshiba facility. each reel includes the same rank leds. let the delivery ratio of eac h rank be unquestioned. luminous intensity i v rank min max qa 63 125 ra 100 200 sa 160 320 ta 250 500 ua 400 800 unit mcd mcd optical characteristics?2 (ta = 25c) emission spectrum peak emission wavelength p ? dominant wavelength d part number min typ. max typ. min typ. max i f tlrh1100d ? 644 ? 18 624 630 638 tlrmh1100d ? 636 ? 17 620 626 634 tlsh1100d ? 623 ? 17 607 613 621 tloh1100d ? 612 ? 15 599 605 613 tlyh1100d ? 590 ? 15 581 587 595 20 unit nm nm nm ma the cautions ? this visible led lamp also emits some ir light if a photodetector is located near the led lamp, please ensure that it will not be affected by the ir light. ? this product is designed as a general display light sour ce usage, and it has applied the measurement standard that matched with the sensitivity of human's ey es. therefore, it is not intended for usage of functional application (ex. light source for sensor, optical communication and etc) except general display light source.
tl(rh,rmh,sh,oh,yh)1100d(t11) 2011-03-15 4 tlrh1100d i f = 20 ma ta = 25c 0 640 0.4 1.0 0.8 580 680 660 620 600 700 0.6 0.2 relative luminous intensity case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) ta = 25c radiation pattern 30 0 60 90 90 30 60 1.00.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 0.1 0.5 3 0.3 ? 20 0 20 40 60 80 1 forward current i f (ma) i v ? i f luminous intensity i v (mcd) 1 1 10 100 100 1000 10 30 3 300 3 30 ( t yp . ) ( t yp . ) wavelength characteristic ( t yp . ) ( t yp . ) i f ? v f forward current i f (ma) forward voltage v f (v) ( t yp . ) 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3
tl(rh,rmh,sh,oh,yh)1100d(t11) 2011-03-15 5 tlrmh1100d ta = 25c radiation pattern 30 0 60 90 90 30 60 1.00.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 relative luminous intensity case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) 0.1 0.5 3 0.3 ? 20 0 20 40 60 80 1 0 580 620 640 660 700 0.2 0.4 0.6 0.8 1.0 i f = 20 ma ta = 25c 600 680 forward current i f (ma) i v ? i f luminous intensity i v (mcd) 1 1 10 100 100 1000 10 30 3 300 3 30 ( t yp . ) ( t yp . ) wavelength characteristic ( t yp . ) ( t yp . ) forward voltage v f (v) i f ? v f forward current i f (ma) ( t yp . ) 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3
tl(rh,rmh,sh,oh,yh)1100d(t11) 2011-03-15 6 tlsh1100d ta = 25c radiation pattern 30 0 60 90 90 30 60 1.00.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 i f = 20 ma ta = 25c 0 640 0.4 1.0 0.8 580 680 660 620 600 700 0.6 0.2 relative luminous intensity forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) 1 1 10 100 100 1000 10 300 30 3 3 30 0.1 0.5 3 0.3 ? 20 0 20 40 60 80 1 ( t yp . ) ( t yp . ) wavelength characteristic ( t yp . ) ( t yp . ) forward voltage v f (v) i f ? v f forward current i f (ma) ( t yp . ) 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3
tl(rh,rmh,sh,oh,yh)1100d(t11) 2011-03-15 7 tloh1100d i f = 20 ma ta = 25c 0 600 0.4 1.0 0.8 540 640 620 580 560 660 0.6 0.2 relative luminous intensity forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) ta = 25c radiation pattern 30 0 60 90 90 30 60 1.00.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 0.1 0.5 3 0.3 ? 20 0 20 40 60 80 1 1 1 10 100 1000 10 100 300 30 3 3 30 ( t yp . ) ( t yp . ) wavelength characteristic ( t yp . ) ( t yp . ) forward voltage v f (v) i f ? v f forward current i f (ma) ( t yp . ) 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3
tl(rh,rmh,sh,oh,yh)1100d(t11) 2011-03-15 8 tlyh1100d ta = 25c radiation pattern 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 relative luminous intensity forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) i f = 20 ma ta = 25c 600 540 640 620 580 560 1.0 0.8 0.6 0.4 0.2 0 660 0.1 0.5 3 0.3 ? 20 0 20 40 60 80 1 1 1 10 100 1000 10 100 300 30 3 3 30 ( t yp . ) ( t yp . ) wavelength characteristic ( t yp . ) ( t yp . ) forward voltage v f (v) i f ? v f forward current i f (ma) ( t yp . ) 1 1.7 1.9 2.1 2.3 2.5 10 100 30 3
tl(rh,rmh,sh,oh,yh)1100d(t11) 2011-03-15 9 packaging these led devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. the optical characteristics of the devi ces may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. this moisture proof bag may be stored unopene d within 12 months at the following conditions. temperature: 5 c to 30 c humidity: 90% (max) 2. after opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of 5c to 30c/60% rh or below. 3. if upon opening, the moisture in dicator card shows humidity 30% or above (color of indication changes to pink) or the expiration date has passed, the de vices should be baked in taping with reel. after baking, use the baked devices within 72 hours, but perform baking only once. baking conditions: 60 5c, for 12 to 24 hours. expiration date: 12 months from sea ling date, which is imprinted on the same side as this label affixed. 4. repeated baking can cause the pee ling strength of the taping to change , then leads to trouble in mounting. furthermore, prevent the devices from being destru cted against static electricity for baking of it. 5. if the packing material of laminate would be broken , the hermeticity would deteriorate. therefore, do not throw or drop the packed devices. mounting method soldering ? reflow soldering (example) ? the products are evaluated using above reflow soldering conditions. no additi onal test is performed exceed the condition (i.e. the condition more than (*)max values) as a evaluation. please perform reflow soldering under the above conditions. ? please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. ? second reflow soldering in case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. storage conditions before the second reflow soldering: 30 c, 60% rh (max) ? make any necessary soldering corrections manually. (only once at each soldering point) soldering iron : 25 w temperature : 300 c or less time : within 3 s ? if the products need to be performe d by other soldering method (ex. wave soldering), please contact toshiba sales representative. land pattern dimensions for reference only 1.65 1.15 2.41 unit: mm 1.65 60 to 120 s 10 s max 240 c max 4 c/s max 140 to 160 c 4 c/s max time (s) package surface temperature ( c) temperature profile for pb soldering (example) time (s) package surface temperature ( c) temperature profile for pb-free soldering (example) 150 to 180 c 4 c/s max 5 s max 260 c max 4 c/s max 230 c 60 to 120 s (*) (*) (*) (*) (*) (*) (*) (*) max (*) max (*) max (*) 30 to 50s max (*) max (*)
tl(rh,rmh,sh,oh,yh)1100d(t11) 2011-03-15 10 cleaning when cleaning is required after soldering, toshiba recommends the following cleaning solvents. it is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). in selecting the one for your actual usage, please perform sufficient review on washing condition, us ing condition and etc. asahi clean ak-225aes : (made by asahi glass) kao clean through 750h : (made by kao) pine alpha st-100s : (made by arakawa chemical) precautions when mounting do not apply force to the plastic part of the led under high-temperature conditions. to avoid damaging the led plastic, do not apply friction using a hard material. when installing the pcb in a product, ensure that the device does not come into contact with other components. tape specifications 1. product number format the type of package used for shipment is denote d by a symbol suffix after the product number. the method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard toshiba specifications) (1) tape type: t11 (4-mm pitch) (2) example 2. tape dimensions unit: mm symbol dimension tolerance symbol dimension tolerance d 1.5 +0.1/?0 p 2 2.0 0.05 e 1.75 0.1 w 8.0 0.3 p 0 4.0 0.1 p 4.0 0.1 t 0.3 0.05 a 0 2.9 0.1 f 3.5 0.05 b 0 3.7 0.1 d 1 1.5 0.1 k 0 2.3 0.1 tlrh100d (t11) tape type toshiba product no. a 0 p d 1 f e w polarity t k 0 b 0 d p 2 p 0
tl(rh,rmh,sh,oh,yh)1100d(t11) 2011-03-15 11 3. reel dimensions unit: mm 4. leader and trailer sections of tape note 3: empty trailer section note 4: empty leader section 9 +1/?0 180 +0 ?4 60 13 11.4 1.0 2 0.5 44 (note 3) leading part: 190 mm (min) 40 mm or more (note 4) 40 mm or more
tl(rh,rmh,sh,oh,yh)1100d(t11) 2011-03-15 12 5. packing form (1) packing quantity reel 2,000 pcs carton 10,000 pcs (2) packing form: each reel is sealed in an aluminum pack with silica gel. 6. label format (1) example: tlrh1100d (t11 p/n: toshiba type tlrh1100d(t11 addc note 5 q?ty 2,000 pcs lot number key code for tsb 32c 2000 (rank symbol) use under 5-30degc/60%rh within 168h sealed [[g]]/rohs compatible diffused in ***** *y380xxxxxxxxxxxxxxxxxx* assembled in ***** note 5: add.code includes the following information. (o in-in/in-out (to japan and overseas) (j out-in (to japan) (t out-out (to overseas out of japan) (2) label location tape feel direction label position label position ? reel ? carton ? the aluminum package in which the reel is supplied also has the label attached to center of one side.
tl(rh,rmh,sh,oh,yh)1100d(t11) 2011-03-15 13 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale fo r product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

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